Tuesday, 2 October 2007

ASE & NXP Complete New Assembly and Test JV

Advanced Semiconductor Engineering (ASE) and NXP Semiconductors have completed the assembly and test joint venture which they announced earlier this year and renamed the new company ASEN.

According to the newly formed organisation, ASEN, has been strategically located in the Suzhou Industrial Park, Southern China to serve the rapidly growing global semiconductor assembly and test market.

As a joint venture, ownership is split between ASE (60%) and NXP (40%), and the Board consists of senior executives from both companies. Initially ASEN will focus on mobile communications; however it is expected to expand into other segments in the future. To meet customer needs, ASEN will offer a variety of package types, such as low pin count QFN, LFBGA, SO, TSSOP and other common packages for mobile applications.

“The ASEN JV combines ASE’s expertise in assembly and test, NXP’s technology know-how and innovative processes. Together, we deliver strong value across the entire semiconductor industry chain, helping customers to optimize their assembly and test, shortening their time to market and ensuring high quality, cost-effective products,” said Dr. Tien Wu, Chief Operating Officer, ASE Group.

ASEN will leverage and expand the previous assembly and test facility of NXP Semiconductors in Suzhou. The ASEN facility is also targeted for further expansion within the next few years. The Suzhou Industry Park is an excellent location for ASEN as it has a well developed business-friendly infrastructure and provides the company proximity to its customers and markets.