AMD Unveils Initiatives for the Broader Computing Ecosystem
By Indu Britto
AMD has released details around its next-generation microprocessor architecture; system-level technology initiatives that are designed to enable greater interoperability and value-added design opportunities for partners using AMD platforms; and advances in AMD’s innovative manufacturing and process technologies. Additionally, AMD announced its plans for a new high-performance enthusiast platform.
AMD President and Chief Executive Office, Hector Ruiz
“In 2003, AMD started down a path to reinventing the microprocessor industry with the introduction of our AMD64 architecture,” said Chairman and CEO Hector Ruiz. “And with unprecedented customer and market momentum, we are accelerating on that path with game-changing strategies to expand our capacity, extend our system-level performance and performance-per-watt leadership, and provide a simpler, more open and “innovation-friendly” x86-based platform to those who want to collaborate in the development of differentiated, customer-centric solutions. Today’s announcements represent AMD’s future - and a view into the great global corporation we are well on our way to creating.”
President and COO Dirk Meyer said, “While we are extremely gratified by the customer acceptance and market success we have enjoyed, considering the environment in which we are competing, we remain focused and are steadily and methodically executing against our business goals. The advancements announced today demonstrate truly exceptional technology leadership in every aspect of our business. With the help of our partners and customers, we will accelerate our pace of innovation and maintain AMD’s leadership.”
AMD’s announcements covered a wide array of technologies and markets, including server, desktop and mobile computing and from silicon to software. Key industry partners, including Alienware, Cray, HP, Rackable Systems, Sun Microsystems and VMware, participated with AMD executives in an analyst event to underscore the significance of AMD’s initiatives to the broader computing ecosystem.
New Enthusiast Platform - 4x4
AMD also announced plans for a new enthusiast platform codenamed “4x4”, featuring a four-core, multi-socket processor configuration uniquely possible via AMD’s Direct Connect Architecture. The 4X4 platform will be designed to be upgraded to eight total processor cores when AMD launches quad-core processors in 2007. Project 4x4 represents system-level enthusiast enhancements and is designed for ultimate multi-tasking performance across gaming, digital video, processor-intensive and heavily-threaded applications.
AMD's Design Directions for the Future
Chief Technology Officer Phil Hester outlined AMD’s primary design directions for the future. . Hester unveiled AMD’s next-generation architecture for server and desktop processors, a new chip design for future mobile platforms, and AMD’s updated processor and platform technology roadmaps.
AMD’s next-generation architecture for servers, workstations and desktops is planned to debut in mid-2007. Products will include a quad-core design for servers, workstations and high-end desktops, and a dual-core design intended for mainstream desktop markets. These next generation processors will be built using AMD’s 65nm Silicon-on-Insulator process, and include a unique new ability to dynamically alter the frequency of each core on the chip to match application workloads and thereby reduce overall power consumption. As a result, AMD expects to increase the performance-per-watt of today’s AMD Opteron processor-powered servers by approximately 60 percent through 2007, and by approximately 150 percent through 2008.
AMD’s new mobile design is planned for the second half of 2007, and includes key architectural advancements. One improvement increases the ability for future AMD dual-core mobile chips to dynamically power one or both cores on or off, and subsequently throttle the chip’s HyperTransport technology bandwidth, depending on the notebook’s current state and running applications.
In demonstration of AMD’s open and collaborative approach to innovation, Senior Vice President, Commercial Segment Marty Seyer detailed three complementary strategic initiatives designed to accelerate industry-wide innovation on the AMD64 platform:
Torrenza represents the industry’s first open, customer-centric x86 innovation platform, capitalizing on the Direct Connect Architecture and HyperTransport advantages of the AMD64 architecture to enable other processor and hardware providers to innovate within a common ecosystem.
Trinity is AMD’s strategy to uniquely link, through an open approach, security, virtualization and manageability technologies. “Trinity” is intended to enable greater flexibility and reduced costs associated with managing, securing and scaling commercial client and server platforms.
A project codenamed Raiden will build on “Trinity” to reinvent the commercial client experience. “Raiden” is intended to enable platforms designed to improve IT efficiency without compromising the expected end-user experience.
AMD also updated its manufacturing and process technology direction — building on the earlier news this week of the company’s newest fabrication facility through a major transformation of its Dresden-based Fab 30, which will be converted to 300mm production in 2007 and named Fab 38. AMD also demonstrated 65nm products from its newest Fab 36 facility in Dresden, using 65nm process technology jointly developed by a team of AMD and IBM engineers in New York as part of AMD and IBM’s successful process development and research collaboration. AMD also announced that its transition to 45nm technology is accelerating. AMD’s plan is to begin initial volume production of 45nm 18 months after initial 65nm production, currently anticipated to be in the mid-2008 time frame.
